Η Qualcomm is expected to introduce a heatsink design called Heat Pass Block (HPB) on Snapdragon 8 Elite Gen 6 Pro
This technology is said to be the same as that used in Samsung Exynos 2600, with a special thermal layer on top of the chip package to accelerate heat dissipation from the core area and prevent performance bottlenecks caused by overheating.
Given Qualcomm's recent pursuit of higher clock speeds, there are even rumors that its maximum clock speed Snapdragon 8 Elite Gen 6 Pro can also exceed 6 GHz.
In addition to the upgrades in the way heat is dissipated, the Snapdragon 8 Elite Gen 6 Pro can adopt the Package-on-Package (PoP) packaging, stacking memory directly above the processor to save space and improve performance.
The new chip will also support LPDDR6 and LPDDR5X memory, as well as storage UFS 5.0 via dual high-frequency broadband channels. Specifically, a new leak mentions multi-display output capabilities, suggesting that future phones equipped with this chip may offer more comprehensive support for external displays and complex desktop functions.
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